1. Entwodiksyon
The Infiray Infisense Mini2 640X512 module is an advanced uncooled thermal imaging camera. It utilizes a high frame rate 12µm WLP package detector and the second-generation self-developed infrared ISP chip (LY Series). This module is designed with high performance, small volume, light weight, low power consumption, and low cost, meeting the SWaP (size, weight, and power/price) application requirements.
The Infiray Infisense Mini2 640X512 Uncooled Infrared Module features a shutter-less algorithm, ensuring smooth and stutter-free image display. It incorporates a new generation infrared dedicated image algorithm, generating delicate and clear thermal images. The module offers multiple digital interfaces, allowing flexible integration with various intelligent processing platforms.
Karakteristik kle:
- High frame rate for dynamic thermal capture.
- Standard shutter-less algorithm for continuous, smooth imaging.
- High quality image display with clear thermal details.
- Optimized cost performance for a wide range of applications.
Senaryo aplikasyon:
- UAV Search: Ideal for photoelectric pods in unmanned aerial vehicles.
- Portable Terminals: Suitable for outdoor handheld devices and helmet-mounted night vision systems.
- Security/Fire Inspection: Applicable in industrial monitoring, perimeter scanning, inspection robots, fire warning systems, and fire helmets.
- Intelligent Integration: Can be integrated into assisted driving systems and smart home appliances.
2. Pwodwi souview

Figi 2.1: Devan view of the Infiray Mini2 640 module.

Figure 2.2: The compact Infiray Mini2 640 module held in a gloved hand, showcasing its small size.
Video 2.1: A demonstration of the Infiray Mini2 640X512 9mm Lens MIPI Interface, showcasing the uncooled LWIR infrared thermal camera designed for FPV drone use.
3. Enstalasyon ak Koneksyon
The Mini2 640 module is designed for integration into host systems. Proper connection of power, data, and video interfaces is crucial for its operation. Refer to the diagrams and tables below for detailed pin definitions and accessory descriptions.
3.1 Accessories and Cables

Figure 3.1: Accessories and Cables Description. This table details various connection components such as FPC cables (50pin to 50pin, 50pin to connecting finger), a USB board for USB2.0 graphing, analog video, serial communication, and USB power, and a Type-C data cable for analog video and serial communication.
3.2 HIROSE50 Pin Definition
The module uses a 50PIN male connector (model: DF40C-50DP-0.4V(51)). The following table and diagrams provide the pin definitions and layout for proper electrical connection.

Figure 3.2: HIROSE50 Pin Definition. This table lists pin numbers, names (e.g., DVP_CLK, DVP_VSYNC, MIPI_D0_P/N, USB_DP, PAL_OUT, UART0_TX, I2C_SLV_SCK, NRST, VDD5.0, VDD3.3, DGND, NC), their respective output/input types, and revision content (e.g., DVP data signal, MIPI data signal, Analog output signal, Universal asynchronous receiver/transmitter pins, I2C slave clock/data, Reset, Power supply, Ground).
- NOTE 1: The order of pin numbers and pin names in the table is consistent.
- NOTE 2: The default voltage for DVP and IIC slave is 1.8V, which can be switched to 3.3V by command.
- NOTE 3: The default voltage for UART0, UART1, and IIC master is 3.3V and cannot be switched.
- NOTE 4: The hardware description here is only for product selection reference. Please contact our technicians for detailed hardware development information during specific development.
- NOTE 5: CVBS only supports black-hot/white-hot switching.

Figure 3.3: Interfaces and Accessories, HIROSE50 Pinout Diagram A and B. These diagrams provide a visual representation of the 50PIN male connector (DF40C-50DP-0.4V(51)) and its pin assignments, crucial for correct wiring and integration.
4. Operasyon
The Infiray Mini2 640 module is designed as a component for integration into larger systems. Its operation is typically controlled by the host platform it is connected to. The module provides raw thermal data or processed video streams via its digital and analog interfaces.
4.1 Image Adjustment Features
The module supports several image adjustment features, which can typically be controlled via the communication interface (e.g., UART, I2C) by the host system:
- Non-uniformity Correction: Utilizes a shutter-correction/shutter-less algorithm for consistent image quality.
- Brightness/Contrast Adjustment: Adjustable from 0 to 100 (optional).
- Polarity/Palette: Supports White-hot, Black-hot, and various other palettes.
- Zoom dijital: Continuous zoom from 1.0x to 8.0x (step size: 0.1).
- Image Mirroring: Vertical/Horizontal/Diagonal mirroring options.
For detailed control commands and software integration, please refer to the specific SDK and API documentation provided by Infiray for developers.
5. Antretyen
To ensure optimal performance and longevity of your Infiray Mini2 640 module, follow these general maintenance guidelines:
- Netwayaj: Gently clean the lens and module exterior with a soft, lint-free cloth. Avoid abrasive materials or harsh chemicals. For stubborn dirt on the lens, use a lens cleaning solution specifically designed for optical components.
- Manyen: Handle the module with care. Avoid dropping it or subjecting it to strong impacts. When connecting cables, ensure proper alignment to prevent damage to the connectors.
- Depo: Store the module in a dry, dust-free environment within the specified storage temperature range (-50°C to +85°C) and humidity (5%-95%, non-condensing).
- Pwoteksyon anviwònman: While the module is designed for various environments, protect it from extreme conditions beyond its operating limits, such as direct exposure to corrosive substances or excessive moisture.
NAN. Depanaj
This section provides general troubleshooting tips. For complex issues, it is recommended to consult the Infiray technical support or the documentation for your specific host system integration.
| Pwoblèm | Kòz posib | Solisyon |
|---|---|---|
| Pa gen pwodiksyon imaj |
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| Imaj ki pa bon kalite (flou, bri) |
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| Module not recognized by host system |
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7. Espesifikasyon
7.1 Espesifikasyon teknik

Figure 7.1: Technical Specifications. This table provides detailed information on the module's performance and characteristics, including detector type (Vanadium Oxide Uncooled Infrared Focal Plane Detector), resolution options (256x192, 384x288, 640x512), effective frame rate, pixel pitch (12µm), spectral band (8-14µm), NETD, thermal time constant, image adjustment features, electrical parameters (5V power supply, typical power consumption), physical characteristics (weight, dimensions), and environmental adaptability (operating/storage temperature, humidity, vibration, impact).
7.2 Lens Parameters (Table 2-3 from image)

Figure 7.2: Lens Parameters. This table (Table 2-3) outlines the specifications for different lens options, including Lens Code, Focal Length (mm), F-number, IFOV, Focus range, Detection Distance, Recognition Distance, Identification Distance, and Weight (Lens and Flange).
8. Garanti ak sipò
For warranty information, technical support, or service inquiries, please contact your point of purchase or the official Infiray support channels. Ensure you have your product model and any relevant purchase details available when seeking support.
9. Konsèy itilizatè yo
Pandan ke pa gen okenn itilizatè espesifik reviews or Q&A were provided, general tips for thermal imaging modules include:
- Integration Planning: Thoroughly plan your integration with the host system, considering power requirements, data interfaces, and physical mounting.
- Devlopman Lojisyèl: If developing custom software, leverage the provided SDKs and documentation for efficient integration and control of module features.
- Konsiderasyon anviwònman an: Be mindful of the operating environment. Extreme temperatures or high humidity can affect performance.
- Kalibrasyon: Understand if and when calibration (e.g., NUC - Non-Uniformity Correction) is performed automatically or if manual triggers are available/necessary for optimal image quality in varying conditions.





